10th Episode : Augmented AI: Navigating the Future of Technology and 5G/6G with Dr. Saurabh Sinha

The podcast features Dr. Saurabh Sinha, a professor and executive dean at the University of Canterbury, New Zealand, discussing the role of augmented AI (A2I) in shaping the future of technology, particularly in telecommunications and beyond. Dr. Sinha begins by sharing his experience with the IEEE Technology Prediction Reports from 2022 and 2023, where he observed a shift in AI's impact. Initially seen as a standalone technology, AI has now become integral to various domains, both technological and non-technological.

He explains how A2I differs from traditional AI by emphasizing the need to focus on human and societal aspects alongside technological advancements. This approach aligns with the concept of the Fifth Industrial Revolution, where AI is not just about efficiency and speed but also about inclusivity and ethics.

Dr. Sinha delves into the role of A2I in telecommunications, particularly with the advent of 5G and 6G. He highlights the importance of integrating AI with ethics and societal values to ensure technology is inclusive and beneficial to all. He also touches on the ethical implications of AI and how A2I could help address biases and other challenges in the development of AI systems.

The conversation also explores the role of AI in everyday life, the impact of large language models (LLMs), and the importance of ethically aligned design in shaping AI's future. Dr. Sinha advocates for a balanced approach, where AI serves humanity's broader goals, including achieving the United Nations' Sustainable Development Goals.

In closing, he reflects on IEEE's shift in focus towards "advancing technology for humanity" and expresses hope for a future where technology and human values are intertwined to create a better world.

Link to the Original Paper: S. Sinha, J. W. Lambrechts, A. Bimana and A. Ashipala, "Augmented Artificial Intelligence in 5G, 6G, and Beyond: A Quantum Leap," in IEEE Computer, vol. 58, no. 1, pp. 24-32, Jan. 2025, doi: 10.1109/MC.2024.3445532

Produced by: IEEE Technology and Engineering Management Society
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